| Resistance to Soldering Heat |
Appearance: No mechanical damage.
Capacitance change: ≤ ±2.5% or ±0.25 pF, whichever is greater.
Q value:
≥ 1000 for ≥ 30 pF
≥ 400 + 20C for < 30 pF
Insulation resistance (25°C): ≥ initial requirement. |
Preheat at 150°C ~ 180°C for 1 minute, immerse in solder at 260±5°C for 10±1 seconds, test after cooling for 24±2 hours. |
| Thermal Shock |
Appearance: No mechanical damage.
Capacitance change: ≤ ±2.5% or ±0.25 pF, whichever is greater.
Q value:
≥ 1000 for ≥ 30 pF
≥ 400 + 20C for < 30 pF
Insulation resistance (25°C): ≥ 30% of initial requirement.
DWV: Meets initial requirement. |
Test per MIL-STD-202, Method 107, Condition A.
Expose at extreme temperatures for 15 minutes, transfer from min. to max. operating temperature within 5 minutes, repeat for 5 cycles. |
| Moisture Resistance |
Appearance: No mechanical damage.
Capacitance change: ≤ ±0.5% or ±0.5 pF, whichever is greater.
Q value: > 300
Insulation resistance: ≥ 30% of initial requirement.
DWV: Meets initial requirement. |
Test per MIL-STD-202, Method 106. |
| Steady-State Humidity |
Appearance: No mechanical damage.
Capacitance change: ≤ ±0.3% or ±0.3 pF, whichever is greater.
Q value: > 300
Insulation resistance: Meets initial requirement. |
Test per MIL-STD-202, Method 103, Condition A.
Apply 1.5V DC voltage at 85°C / 85% RH continuously for 240 hours. |
| Life |
Appearance: No mechanical damage.
Capacitance change: ≤ ±3% or ±0.3 pF, whichever is greater.
Q value:
≥ 350 for ≥ 30 pF
≥ 200 + 10C for ≤ 10 pF
≥ 275 + 2.5C for 10–30 pF
Insulation resistance: ≥ 30% of initial requirement. |
Test per MIL-STD-202, Method 108.
Apply 1.5× rated voltage at max. operating temperature for 1000 hours. |